{"title":"200mm High performance inertial sensor manufacturing process","authors":"F. Dion, S. Martel, J. DeNatale","doi":"10.1109/ISISS.2018.8358158","DOIUrl":null,"url":null,"abstract":"This paper presents a high performance inertial sensor manufacturing process on 200mm wafers, adapted for applications in the industrial, aerospace, naval, offshore and defense markets. Electrical results for resonant frequency, frequency splits and quality factor are presented to demonstrate the process performance. The process integrates hermetic Wafer Level Packaging (WLP) without requiring a getter.","PeriodicalId":237642,"journal":{"name":"2018 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISISS.2018.8358158","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This paper presents a high performance inertial sensor manufacturing process on 200mm wafers, adapted for applications in the industrial, aerospace, naval, offshore and defense markets. Electrical results for resonant frequency, frequency splits and quality factor are presented to demonstrate the process performance. The process integrates hermetic Wafer Level Packaging (WLP) without requiring a getter.
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