FOWLP and Si-Interposer for High-Speed Photonic Packaging

Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, D. Wee, S. Bhattacharya
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引用次数: 2

Abstract

A FOWLP and a Si-Interposer integration platform for Electronic IC (EIC) and Photonic IC (PIC) are described here. These two platforms are capable to support high-speed integration and scalable design of the next generation Optical Engine. The integration of the PIC on the FOWLP is achieved by a simple novel solution. An additional section of the Si substrate is designed at the end of the PIC to protect the optical I/Os during the FOWLP embedding process. For the Through Si-Interposer, besides providing the EIC and PIC, it include the passive alignment feature for the fibre to the PIC assembly.
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高速光子封装用FOWLP和si中间层
本文介绍了一种用于电子集成电路(EIC)和光子集成电路(PIC)的FOWLP和Si-Interposer集成平台。这两个平台能够支持下一代光引擎的高速集成和可扩展设计。通过一种简单新颖的解决方案实现了PIC与FOWLP的集成。在PIC的末端设计了额外的Si衬底部分,以保护FOWLP嵌入过程中的光学I/ o。对于Through Si-Interposer,除了提供EIC和PIC外,它还包括光纤到PIC组件的无源对准功能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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