2.2D Die last Integrated Substrate for High Performance Applications

D. Hu, E. Chen, J. Lee, Chia-Peng Sun, Chih Chung Hsu
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引用次数: 3

Abstract

In this work, a new integrated substrate structure “2.2D” is demonstrated. 2.2D substrate is a true die last solution. This solution used thin film RDL directly bonded to the substrate. This simplifies the 2.5D structure and further reduces the cost and improves the product cycle time. In this work, the 2.2D test vehicle is demonstrated with two metal layers of thin film that is bonded to a ceramic substrate. Serpentine lines run from thin film RDL to the substrate were evaluated. The process developed in this study demonstrates good registration between thin film RDL and substrate. The 2.2D TV demonstrates good warpage behavior up to the solder reflow temperature. The 2.2D structure shows good potential to be used for high performance computing substrate.
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用于高性能应用的2d最后集成基板
在这项工作中,展示了一种新的集成衬底结构“2.2D”。2.2D衬底是真正的最后一种解决方案。该解决方案采用薄膜RDL直接粘合到衬底上。这简化了2.5D结构,进一步降低了成本,提高了产品周期时间。在这项工作中,2.2D测试车辆展示了与陶瓷基板结合的两层金属薄膜。对从薄膜RDL到衬底的蛇形线进行了评价。本研究开发的工艺表明薄膜RDL与衬底之间具有良好的配准性。2.2D电视显示良好的翘曲行为,直至焊料回流温度。这种2.2D结构在高性能计算基板上显示出良好的应用潜力。
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