Electronics Packaging Technologies for Automotive Electronics

Abstract

To enable automotives to be more intelligent and reliable, increasing amounts of electronic systems are embedded inside automotives. Moreover, adopting advanced packaging technologies, such as System-in-Package (SiP), not only can reduce the overall module size but also the number of components, i.e. less handling and bill-of-materials. Nevertheless, reliability is always critical in the development of automotive electronics, particularly when the solder joint materials in automotive electronics work under prolonged harsh working environment, it always requires additional attention to ensure the solder joint reliability can meet the stringent requirements in various international standards.