J. Kallis, L. B. Duncan, S. Laub, M. J. Little, L.M. Miani, D.C. Sandkulla
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引用次数: 6
Abstract
An assessment of the mechanical reliability of the 3-D Computer is presented. The purpose of this reliability assessment was to gain confidence in the feasibility of this stacked-wafer approach for space-based applications. The investigation addressed both the mechanical and thermal reliability by means of analyses and experiments.<>
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