{"title":"A broadband CPW-to-microstrip via-less transition for on wafer package probing applications","authors":"L. Zhu, K. Melde, J. Prince","doi":"10.1109/EPEP.2003.1250003","DOIUrl":null,"url":null,"abstract":"A broadband CPW to microstrip via-less transition is proposed and the optimal design is discussed. Simulation and measurement results are given. The results of the transition as multiline TRL calibration standards are presented.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250003","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
A broadband CPW to microstrip via-less transition is proposed and the optimal design is discussed. Simulation and measurement results are given. The results of the transition as multiline TRL calibration standards are presented.
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