O. Gaathon, A. Ofan, J. Dadap, A. Wirthmüller, L. Vanamurthy, S. Bakhru, H. Bakhru, R. Osgood
{"title":"Femtosecond laser milling of ultrathin films of LiNbO3","authors":"O. Gaathon, A. Ofan, J. Dadap, A. Wirthmüller, L. Vanamurthy, S. Bakhru, H. Bakhru, R. Osgood","doi":"10.1117/12.785420","DOIUrl":null,"url":null,"abstract":"We report femtosecond laser cutting of ultrathin ferroelectric sheets. This process enables one to do rapid patterning of microns-thick films of complex oxides such as LiNbO3, which are obtained via ion-beam exfoliation from standard wafers. Cutting these fragile samples is extremely difficult using standard methods but can be done effectively with ultrafast lasers. To achieve fast writing speed, we employ a high-repetition-rate amplified Ti:sapphire laser system with a pulse peak power of ~100MW. Optimization of the depth and quality of cut were determined as a function of laser pulse energy, crystallographic axes, optical polarization, and pre- and post-ablation chemical treatments.","PeriodicalId":249315,"journal":{"name":"High-Power Laser Ablation","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"High-Power Laser Ablation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.785420","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We report femtosecond laser cutting of ultrathin ferroelectric sheets. This process enables one to do rapid patterning of microns-thick films of complex oxides such as LiNbO3, which are obtained via ion-beam exfoliation from standard wafers. Cutting these fragile samples is extremely difficult using standard methods but can be done effectively with ultrafast lasers. To achieve fast writing speed, we employ a high-repetition-rate amplified Ti:sapphire laser system with a pulse peak power of ~100MW. Optimization of the depth and quality of cut were determined as a function of laser pulse energy, crystallographic axes, optical polarization, and pre- and post-ablation chemical treatments.