A. Hamani, F. F. Manzillo, A. Siligaris, N. Cassiau, F. Hameau, F. Chaix, C. Dehos, A. Clemente, J. González-Jiménez
{"title":"A 56.32 Gb/s 16-QAM D-band Wireless Link using RX-TX Systems- in-Package with Integrated Multi-LO Generators in 45nm RFSOI","authors":"A. Hamani, F. F. Manzillo, A. Siligaris, N. Cassiau, F. Hameau, F. Chaix, C. Dehos, A. Clemente, J. González-Jiménez","doi":"10.1109/RFIC54546.2022.9863127","DOIUrl":null,"url":null,"abstract":"This paper presents an energy-efficient wideband D- band wireless link using receiver (RX) and transmitter (TX) modules based on a channel-bonding scheme. The modules include RX and TX integrated circuits (ICs) fabricated in 45nm CMOS RFSOI technology. They are mounted on low-cost multi-layer printed circuit boards (PCBs) and connected to patch antennas. The RX and TX ICs are composed of two down-conversion and up-conversion chains, respectively, operating over contiguous sub- bands around 147.96 GHz. The required multiple millimeter-wave local oscillator signals (LOs)are generated on-chip. The presented wireless system achieves a data rate of 56.32 Gb/s by using 16 QAM modulation over 8 radiofrequency (RF) channels, with a competitive energy consumption (RX+TX) of 18 pJ/bit, including the LOs generation circuitry.","PeriodicalId":415294,"journal":{"name":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC54546.2022.9863127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This paper presents an energy-efficient wideband D- band wireless link using receiver (RX) and transmitter (TX) modules based on a channel-bonding scheme. The modules include RX and TX integrated circuits (ICs) fabricated in 45nm CMOS RFSOI technology. They are mounted on low-cost multi-layer printed circuit boards (PCBs) and connected to patch antennas. The RX and TX ICs are composed of two down-conversion and up-conversion chains, respectively, operating over contiguous sub- bands around 147.96 GHz. The required multiple millimeter-wave local oscillator signals (LOs)are generated on-chip. The presented wireless system achieves a data rate of 56.32 Gb/s by using 16 QAM modulation over 8 radiofrequency (RF) channels, with a competitive energy consumption (RX+TX) of 18 pJ/bit, including the LOs generation circuitry.
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