Integrated Connector for Silicon Photonic Co-package Optics with Strain Relief Accommodation Through Fiber Bending

Abstract

Automated fiber to V/U-groove assemblies offer a robust and cost-effective solution to interface single mode fibers to silicon photonic integrated circuits; however, the handling and assembly of long pigtails attached to photonic packages pose significant challenges. An integrated high-bandwidth optical connector with a latching mechanism secured to the module could eliminate these packaging challenges and provide an attractive alternative for photonic products. A multi-fiber interface integrating a standard single mode fiber mechanical transfer connector to a co-package photonics module is studied here. The geometric configuration exploits the fiber bending to accommodate the strain and control the stress at both anchor points throughout temperature excursions. We demonstrate the benefits of using fibers longer than 25mm for the selected configuration. A fiber exit angle of a few degrees can provide some advantages in controlling the fiber buckling direction and reducing the fiber pistoning. It may however, along with other factors, be detrimental to the internal stress at reflow temperatures.