{"title":"Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder","authors":"Huang Wang, A. Hu, Cheng Li, D. Mao","doi":"10.1109/ICEPT.2007.4441468","DOIUrl":null,"url":null,"abstract":"Concentrations of 0.1. 0.3. and 0.5 wt.% of Cr were added to Sn-3Ag-3Bi alloy to produce Sn-Ag-Bi-Cr alloys. The microstmcture is refined with Cr additions, while significantly improves the oxidation resistance. There is no change in the wettability and liquidus temperature after Cr additions. In addition, the effect of Cr addition on the intermetallic compounds was discussed.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441468","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Concentrations of 0.1. 0.3. and 0.5 wt.% of Cr were added to Sn-3Ag-3Bi alloy to produce Sn-Ag-Bi-Cr alloys. The microstmcture is refined with Cr additions, while significantly improves the oxidation resistance. There is no change in the wettability and liquidus temperature after Cr additions. In addition, the effect of Cr addition on the intermetallic compounds was discussed.
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