R. Steiner, M. Schneider, F. Mayer, U. Munch, T. Mayer, H. Baltes
{"title":"Fully packaged CMOS current monitor using lead-on-chip technology","authors":"R. Steiner, M. Schneider, F. Mayer, U. Munch, T. Mayer, H. Baltes","doi":"10.1109/MEMSYS.1998.659826","DOIUrl":null,"url":null,"abstract":"A compact CMOS monitor system for galvanically isolated current measurement is presented. It is packaged with standard lead-on-chip technology and completely in line with commercial IC production. This technology includes inexpensive and high volume batch fabrication of chips followed by automatic mass packaging. The system has a linear response in a range of /spl plusmn/10 A with a small non-linearity below /spl plusmn/0.3%. This results in a measurement accuracy of better than 50 mA. The accuracy is further improved by soft ferromagnetic field concentrators.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1998.659826","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
A compact CMOS monitor system for galvanically isolated current measurement is presented. It is packaged with standard lead-on-chip technology and completely in line with commercial IC production. This technology includes inexpensive and high volume batch fabrication of chips followed by automatic mass packaging. The system has a linear response in a range of /spl plusmn/10 A with a small non-linearity below /spl plusmn/0.3%. This results in a measurement accuracy of better than 50 mA. The accuracy is further improved by soft ferromagnetic field concentrators.