Higher k HfTaTiO gate dielectric with improved material and electrical characteristics

N. Lu, H. Li, M. Gardner, D. Kwong
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引用次数: 3

Abstract

Physical and electrical characteristics of HfTaTiO gate dielectric have been systematically investigated for the first time. HfTaTiO has a higher dielectric constant (kappa~56) and acceptable barrier height to Si (phi=1.0eV), and ultra-thin EOT(~9Aring) has been achieved. HfTaTiO dielectric shows higher crystallization temperature (900degC), reduced hysteresis, 50% higher mobility and improved Vth instability than HfO2. Moreover, HfTaTiO exhibits excellent SILC and breakdown characteristics
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高k HfTaTiO栅极电介质,改善了材料和电学特性
本文首次系统地研究了HfTaTiO栅介质的物理和电学特性。HfTaTiO具有较高的介电常数(kappa~56)和可接受的Si势垒高度(phi=1.0eV),实现了超薄EOT(~9Aring)。与HfO2相比,HfTaTiO具有更高的结晶温度(900℃),降低了迟滞,迁移率提高了50%,并改善了Vth不稳定性。此外,HfTaTiO具有优异的SILC和击穿特性
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