Inverter/converter power density and flexibility improvements through modularity and novel thermal management architecture

Abstract

This paper explains the technical challenges that come with miniaturization of inverter and converter technology and how Marel addresses these challenges through modularity, specialized manufacturing techniques, and a unique thermal management architecture. It will build upon silicon and silicon carbide die choice and die attach on substrate, and continue by explaining the thermal pathways and innovations surrounding the cooling system. It will also tie in Marel’s building block approach and show how the same blocks can be applied to liquid and air cooled system designs.