Development of thermal solutions for high performance laptop computers

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012489

H.Y. Zhang, D. Pinjala, O.K. Navas, M. Iyer, P. Chan, X.P. Liu, H. Hayashi, J. Han

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引用次数: 3

Abstract

In this research project, advanced thermal solutions for high performance laptop computer have been developed. This development involves design and implementation of a heat sink assembly, application of a heat pipe and thermal evaluation by modeling and measurement. The heat sink assembly has been designed and the thermal performance has been examined by measurements. A heat pipe assembly with two heat spreaders has been designed as the heat transport medium from microprocessor to the heat sink. In the system modeling, a compact model for the flip chip BGA package has been developed. Implementation of the compact model for the packages in the system modeling greatly reduces the grid size and thus makes the system simulation feasible. System measurements are performed with thermal solutions. Measurement results show that present thermal solutions are able to dissipate a power of 25 to 30 W from the microprocessor. The predicted junction temperatures by system simulation are compared with measurements and an agreement within 4% has been attained. Parametric studies have been conducted with the validated system level model.

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高性能笔记本电脑散热解决方案的开发

在这个研究项目中，开发了高性能笔记本电脑的先进散热解决方案。该开发涉及散热器组件的设计和实现，热管的应用以及通过建模和测量进行的热评估。设计了散热器组件，并对其热性能进行了测试。设计了带有两个散热器的热管组件作为微处理器到散热器的传热介质。在系统建模中，建立了倒装芯片BGA封装的紧凑模型。在系统建模中实现了封装的紧凑模型，大大减小了网格尺寸，从而使系统仿真变得可行。系统测量是用热溶液进行的。测量结果表明，目前的热解决方案能够从微处理器消耗25至30 W的功率。通过系统仿真得到的结温预测值与实测值进行了比较，两者的吻合度在4%以内。通过验证的系统级模型进行了参数化研究。

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ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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