A geometric model for leaky wave antenna radiative interconnects for gigabit logic multi chip modules

Abstract

Initial design guidelines for a new MCM interconnection system are reported. These guidelines are based on a consideration of the geometry of the MCM. The interconnection system uses radiative interconnects based on dielectric guide leaky wave antennas to avoid the problems associated with the substrate, viz. reflections, lower propagation velocity and crosstalk. The Geometric Model developed predicts an optimum chip spacing for microwave beams reflected from a package lid as well as the bandwidth and beam pattern of a reflected beam. The results presented agree well with those obtained from Transmission Line Matrix modelling.<>