Test pattern for supply current test of open defects by applying time-variable electric field

H. Yotsuyanagi, M. Hashizume, Taisuke Iwakiri, M. Ichimiya, T. Tamesada
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引用次数: 2

Abstract

Test input vectors for a supply current test method are discussed which is used for detecting open defects in CMOS ICs. In the test method, time-variable electric field is applied from the outside of ICs so as to vary the voltage at a floating node. To generate excessive supply current by the induced voltage change at the floating node, test pattern must be provided so that a conducting path from V/sub DD/ to GND can be generated in the faulty circuit. In this paper, the requirements are denoted to be satisfied as a test input vector of the test method. Also, it is shown that test pattern of functional tests based on stuck-at fault models can be used for the open defect detection method. Furthermore, the experimental results in this paper promise that high fault coverage can be achieved by applying the subset of the stuck-at test pattern to the detection of open defects.
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应用时变电场对开路缺陷进行供电电流检测的试验方法
讨论了一种用于检测CMOS芯片开路缺陷的电源电流测试方法的测试输入向量。在测试方法中,从集成电路外部施加时变电场,从而改变浮动节点的电压。为了通过浮动节点的感应电压变化产生过大的电源电流,必须提供测试模式,以便在故障电路中产生从V/sub DD/到GND的导通路径。本文将满足的要求表示为测试方法的测试输入向量。研究表明,基于卡滞故障模型的功能测试模式可用于开放式缺陷检测方法。此外,本文的实验结果表明,将卡在测试模式的子集应用于开放缺陷的检测可以获得较高的故障覆盖率。
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