Low-noise performance near BV/sub CEO/ in a 200 GHz SiGe technology at different collector design points

D. Greenberg, S. Sweeney, G. Freeman, D. Ahlgren
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引用次数: 6

Abstract

We explore the low-noise behavior of both high-f/sub T/ and enhanced-breakdown SiGe HBTs, showing key differences as a function of V/sub CB/. Both devices achieve values for F/sub min/ below 0.4, 1.2 and 1.4 dB at 10, 15 and 20 GHz, respectively, with corresponding G/sub A/ values better than 18.5, 14.5 and 13.2 dB. In addition, the enhanced-breakdown device demonstrates the ability to operate at 1 V higher V/sub CB/ compared with the high-f/sub T/ device prior to the onset of avalanche-induced F/sub min/ degradation. Combined with a lower C/sub CB/, this improved V/sub CB/ range allows the device to achieve higher gain for the same or lower noise.
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在200 GHz SiGe技术下,不同集电极设计点的低噪声性能接近BV/sub CEO/
我们研究了高f/sub - T/和增强击穿SiGe HBTs的低噪声行为,显示了V/sub - CB/的关键差异。两种器件在10、15和20 GHz时的F/sub min/值分别低于0.4、1.2和1.4 dB,相应的G/sub A/值优于18.5、14.5和13.2 dB。此外,与雪崩诱发的F/sub min/退化开始前的高F/sub T/装置相比,增强击穿装置显示出在高1 V/sub CB/下工作的能力。结合较低的C/sub CB/,这种改进的V/sub CB/范围允许器件在相同或更低的噪声下实现更高的增益。
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