C. Chen, D. Yost, B. Aull, C. Chen, P. Gouker, J. Knecht, B. Tyrrell, K. Warner, B. Wheeler, P. Wyatt, C. Keast, V. Suntharalingam
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引用次数: 2
Abstract
Presents a collection of slides covering the following topics: bonding; 3D integrated circuit process flow; lithographic requirements; 3-tier single-photon laser-radar focal plane; Nyquist-limited IR focal planes; CMOS technology and SWIR detectors.
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