Effect of Ni-CNTs on wetting properties, microstructure, and creep resistance of Sn58Bi-0.1Er composite solder

2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2021-09-14 DOI:10.1109/ICEPT52650.2021.9568164

Qi Li, Fengmei Liu, Y. Yi, Xueying Zhang, Haitao Gao

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Abstract

Sn-58Bi-0.1Er solder alloys with different Ni-CNTs contents were prepared by vacuum melting, the influence of Ni-CNTs content on the wetting properties of Sn-58Bi-0.1Er solder was studied. The interface morphology of IMC at Sn-58Bi-0.1Er/Cu joint and the creep resistance of Sn-58Bi-0.1Er/Cu joints with different contents of Ni-CNTs were analyzed. The results showed that when added 0.01~0.05 wt% Ni-CNTs, it enhanced the wettability of composite solder alloy on Cu plate, and the inter metallic compound of Sn58Bi/Cu interface changed from sawtooth Cu6Sn5 to thin layer (Cu, Ni)6Sn5. With the increase amount of Ni-CNTs enhanced particles, it can effectively reduce the thickness of IMC layer at the Sn58Bi-0.1Er/Cu interface. By adding Ni-CNTs particles, the creep fracture life of Sn58Bi-0.1Er/Cu joints was greatly improved. The creep fracture life of the joint was the longest when 0.03 wt%Ni-CNTsadded, which was 25650s. The addition of Ni-CNTs reinforcement particles effectively improved the mechanical properties of the Sn58Bi joint.

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Ni-CNTs对Sn58Bi-0.1Er复合钎料润湿性能、显微组织和抗蠕变性能的影响

采用真空熔炼法制备了不同Ni-CNTs含量的Sn-58Bi-0.1Er钎料合金，研究了Ni-CNTs含量对Sn-58Bi-0.1Er钎料润湿性能的影响。分析了Ni-CNTs含量不同的Sn-58Bi-0.1Er/Cu接头IMC界面形貌和Ni-CNTs含量不同的Sn-58Bi-0.1Er/Cu接头的抗蠕变性能。结果表明:当添加0.01~0.05 wt% Ni- cnts时，复合钎料合金在Cu板上的润湿性增强，Sn58Bi/Cu界面的金属间化合物由锯齿状Cu6Sn5转变为薄层(Cu, Ni)6Sn5;随着Ni-CNTs增强颗粒数量的增加，可以有效降低Sn58Bi-0.1Er/Cu界面处IMC层的厚度。添加Ni-CNTs颗粒后，Sn58Bi-0.1Er/Cu接头的蠕变断裂寿命大大提高。添加0.03 wt% ni - cnt时，接头的蠕变断裂寿命最长，为25650s。Ni-CNTs增强颗粒的加入有效地改善了Sn58Bi接头的力学性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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