Computer modelling of the reliability of flip chips with metal column bumping

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012561

H. Lu, C. Bailey

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引用次数: 2

Abstract

Recently, research has been carried out to test a novel bumping method which omits the under bump metallurgy forming process by bonding copper columns directly onto the Al pads of the silicon dies. This bumping method could be adopted to simplify the flip chip manufacturing process, increase the productivity and achieve a higher I/O count. This paper describes an investigation of the solder joint reliability of flip-chips based on this new bumping process. Computer modelling methods are used to predict the shape of solder joints and response of flip chips to thermal cyclic loading. The accumulated plastic strain energy at the comer solder joints is used as the damage indicator. Models with a range of design parameters have been compared for their reliability. The parameters that have been investigated are the copper column height, radius and solder volume. The ranking of the relative importance of these parameters is given. For most of the results presented in the paper, the solder material has been assumed to be the lead-free 96.5Sn3.5Ag alloy but some results for 60Sn40Pb solder joints have also been presented.

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金属柱碰撞倒装芯片可靠性的计算机建模

最近，研究了一种新的碰撞方法，该方法通过将铜柱直接粘接在硅模具的Al衬垫上，从而省去了碰撞下的冶金成形过程。采用这种碰撞方法可以简化倒装芯片的制造工艺，提高生产效率，实现更高的I/O计数。本文介绍了基于这种新型碰撞工艺的倒装芯片焊点可靠性研究。利用计算机建模方法预测了焊点形状和倒装芯片对热循环加载的响应。以焊点角处累积的塑性应变能作为损伤指标。对具有一系列设计参数的模型进行了可靠性比较。研究了铜柱高度、半径和焊料体积等参数。给出了这些参数的相对重要性排序。本文给出的大部分结果都假定焊料为无铅96.5Sn3.5Ag合金，但也给出了60Sn40Pb焊点的一些结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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