D. Su, J. Zhu, D.Y. Wang, H. Chad, C. Choy, Y.N. Wang
{"title":"Microstructure study of Bi/sub 4/Ti/sub 3/O/sub 12/-SrBi/sub 4/O/sub 15/ and Bi/sub 3.25/La/sub 0.75/Ti/sub 3/O/sub 12/-SrBi/sub 4/Ti/sub 4/O/sub 15/ ceramics","authors":"D. Su, J. Zhu, D.Y. Wang, H. Chad, C. Choy, Y.N. Wang","doi":"10.1109/ISAF.2002.1195873","DOIUrl":null,"url":null,"abstract":"TEM study is preformed on mixed-layer type bismuth compounds: Bi/sub 4/Ti/sub 3/O/sub 12/-SrBi/sub 4/T/sub 4/O/sub 15/ (BT-SBTi) and Bi/sub 3.25/La/sub 0.75/Ti/sub 3/O/sub 12/-SrB/sub 4/T/sub 4/O/sub 15/ (BLT-SBTi) ceramics. Meeting the prediction of space group theory, APBs and 90/spl deg/ domain wall are observed by bright- and dark-field imaging in both materials. Besides, other planer defects are found and confirmed to be stacking faults.","PeriodicalId":415725,"journal":{"name":"Proceedings of the 13th IEEE International Symposium on Applications of Ferroelectrics, 2002. ISAF 2002.","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 13th IEEE International Symposium on Applications of Ferroelectrics, 2002. ISAF 2002.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAF.2002.1195873","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
TEM study is preformed on mixed-layer type bismuth compounds: Bi/sub 4/Ti/sub 3/O/sub 12/-SrBi/sub 4/T/sub 4/O/sub 15/ (BT-SBTi) and Bi/sub 3.25/La/sub 0.75/Ti/sub 3/O/sub 12/-SrB/sub 4/T/sub 4/O/sub 15/ (BLT-SBTi) ceramics. Meeting the prediction of space group theory, APBs and 90/spl deg/ domain wall are observed by bright- and dark-field imaging in both materials. Besides, other planer defects are found and confirmed to be stacking faults.
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