Reactive Force-Field Molecular Dynamics Study of the Silicon-Germanium Deposition Processes by Plasma Enhanced Chemical Vapor Deposition

Naoya Uene, T. Mabuchi, M. Zaitsu, Shigeo Yasuhara, T. Tokumasu
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Abstract

In order to form a SiGe thin film by chemical vapor deposition (CVD) with a suitable quality for advanced devices, the relationships between materials/process and structure/composition are needed to be clarified at the atomic level. We simulated SiGe CVD by using reactive force-field (ReaxFF) molecular dynamics simulations, especially on binary systems of SiHx + GeHx, and derived the influence of the substrate temperature and these ratios of gaseous species on the crystallinity and compositions in the thin films. The crystallinity increases as the substrate temperature increases, and the lowest crystallinity is obtained at the ratios of gaseous species 0.5 and 0.7 for the SiH3 and SiH2, respectively. As the substrate temperature increases, the hydrogen content decreases while Si and Ge content tend to increase. These trends can be seen in relevant studies. Through this simulation we successfully observe that the reactivity of gaseous species greatly affects the crystallinity and compositions in the thin films.
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等离子体增强化学气相沉积硅锗过程的反应力场分子动力学研究
为了通过化学气相沉积(CVD)形成适合先进器件的SiGe薄膜,需要在原子水平上澄清材料/工艺与结构/组成之间的关系。采用反应力场(ReaxFF)分子动力学模拟方法,对SiHx + GeHx二元体系进行了SiGe CVD的模拟,得到了衬底温度和气体组分比对薄膜结晶度和组成的影响。结晶度随着衬底温度的升高而升高,SiH3和SiH2的结晶度在气体组分比分别为0.5和0.7时最低。随着衬底温度的升高,氢含量降低,Si和Ge含量有增加的趋势。这些趋势可以在相关研究中看到。通过模拟,我们成功地观察到气体的反应性对薄膜的结晶度和组成有很大的影响。
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