{"title":"Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids","authors":"Pingshan Wang, E. Kan","doi":"10.1109/EPEP.2003.1250011","DOIUrl":null,"url":null,"abstract":"High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below /spl sim/10 GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the rectangular patch antenna theory.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250011","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below /spl sim/10 GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the rectangular patch antenna theory.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
