Timo Tarvainentl, Tuukka Ruokamo, Lauri Hynynen, llkka Kelander, Pia Kotiranta
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引用次数: 3
Abstract
Control of noise coupling between high-speed interconnections and RF components in mobile devices is vital. This paper discusses software-hardware-electromagnetics modeling flow for early on EMI optimization of component, such as high speed interconnection, placement.
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