{"title":"Fatigue of soft-soldered contacts at surface-mounted devices","authors":"H. Hieber","doi":"10.1109/RELPHY.1988.23456","DOIUrl":null,"url":null,"abstract":"An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb/sub 40/ solder is discussed, along with the microstructure of soft-soldered contacts.<<ETX>>","PeriodicalId":102187,"journal":{"name":"26th Annual Proceedings Reliability Physics Symposium 1988","volume":"112 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"26th Annual Proceedings Reliability Physics Symposium 1988","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1988.23456","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb/sub 40/ solder is discussed, along with the microstructure of soft-soldered contacts.<>
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