U. Pfeiffer, J. Grzyb, R. Al Hadi, N. Sarmah, K. Statnikov, S. Malz, B. Heinemann
{"title":"SiGe Transmitter and Receiver Circuits for Emerging Terahertz Applications","authors":"U. Pfeiffer, J. Grzyb, R. Al Hadi, N. Sarmah, K. Statnikov, S. Malz, B. Heinemann","doi":"10.1109/CSICS.2014.6978576","DOIUrl":null,"url":null,"abstract":"This paper presents recent developments on transmitter and receiver circuit in advanced SiGe technologies for emerging applications in the sub-millimeter wave region of the electromagnetic spectrum. This includes high-power harmonic oscillators, multiplier chains, and heterodyne I/Q transmitters for terahertz signal generation, as well as direct detectors, heterodyne receivers and Radar transceivers for wide-band signal detection. The circuits are attached to a secondary silicon lens and packaged on low-cost FR4 printed circuit boards.","PeriodicalId":309722,"journal":{"name":"2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2014.6978576","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper presents recent developments on transmitter and receiver circuit in advanced SiGe technologies for emerging applications in the sub-millimeter wave region of the electromagnetic spectrum. This includes high-power harmonic oscillators, multiplier chains, and heterodyne I/Q transmitters for terahertz signal generation, as well as direct detectors, heterodyne receivers and Radar transceivers for wide-band signal detection. The circuits are attached to a secondary silicon lens and packaged on low-cost FR4 printed circuit boards.
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