{"title":"RX-TX analog front-end module with 2 × 96-channels for mm-wave imaging systems","authors":"A. Schiessl, R. Juenemann, L. Schmidt","doi":"10.23919/EUMC.2012.6459168","DOIUrl":null,"url":null,"abstract":"Active millimeter-wave imaging systems are increasingly utilized in security, medical and industrial applications. At E-Band frequencies, such systems integrate more than three thousand antennas on 2 m × 1 m aperture. Commercial success of those systems requires cost efficient but precise manufacturing technologies to build highly integrated modular mm-wave front ends. Here, a module for a new sparse imaging array architecture is presented. The module is manufactured using a unique mm-wave chip-on-board technology. It operates from 70 GHz to 80 GHz, and integrates 48 MMICs and several thin film ceramic components.","PeriodicalId":243164,"journal":{"name":"2012 7th European Microwave Integrated Circuit Conference","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 7th European Microwave Integrated Circuit Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EUMC.2012.6459168","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
Active millimeter-wave imaging systems are increasingly utilized in security, medical and industrial applications. At E-Band frequencies, such systems integrate more than three thousand antennas on 2 m × 1 m aperture. Commercial success of those systems requires cost efficient but precise manufacturing technologies to build highly integrated modular mm-wave front ends. Here, a module for a new sparse imaging array architecture is presented. The module is manufactured using a unique mm-wave chip-on-board technology. It operates from 70 GHz to 80 GHz, and integrates 48 MMICs and several thin film ceramic components.
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