Fabrication of Ga2O3/3C-SiC direct bonding for efficient surface heat dissipation

H. Nagai, K. Kawamura, Y. Sakaida, Hiroki Uratani, Y. Shimizu, Y. Ohno, Y. Nagai, N. Shigekawa, Jianbo Liang
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Abstract

We successfully fabricate a Ga2O3/3C-SiC direct bonding by the surface-activated bonding (SAB) of 3C-SiC epitaxial layer grown on Si substrate to Ga2O3 substrate. The structure of bonding interface will be investigated by transmission electron microscope (TEM).
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高效表面散热的Ga2O3/3C-SiC直接键合制备
通过在Si衬底上生长的3C-SiC外延层与Ga2O3衬底的表面活化键合(SAB),成功制备了Ga2O3/3C-SiC直接键合。用透射电子显微镜(TEM)研究了键合界面的结构。
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