Design of Embedded Vacuum Packaging System Based on Single-Chip Microcomputer Touch Screen

Ming-fei Qu, Dan Zhao, Nan Chen
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Abstract

In order to improve the intelligent control ability of the embedded vacuum packaging machinery, the control system is optimized and the embedded vacuum packaging system based on the touch screen of single chip microcomputer is constructed. The system is composed of many modules and uses 51 single chip microcomputer as the digital processing chip of energy-saving control of embedded vacuum packaging machinery. Combined with the touch screen control technology of single chip microcomputer, the automatic assembly control design of the embedded vacuum packaging system is carried out, and the optimal transmission protocol of the energy-saving control system of the embedded vacuum packaging mechanical equipment is designed. In the program loading module, the instruction loading and output conversion control of the embedded vacuum packaging system are realized, and the intelligent design of the embedded vacuum packaging system is realized in the embedded integrated processor.
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基于单片机触摸屏的嵌入式真空包装系统设计
为了提高嵌入式真空包装机械的智能控制能力,对控制系统进行了优化,构建了基于单片机触摸屏的嵌入式真空包装系统。该系统由多个模块组成,采用51单片机作为嵌入式真空包装机节能控制的数字处理芯片。结合单片机触摸屏控制技术,进行了嵌入式真空包装系统的自动装配控制设计,设计了嵌入式真空包装机械设备节能控制系统的最优传输协议。在程序加载模块中,实现了嵌入式真空包装系统的指令加载和输出转换控制,并在嵌入式集成处理器中实现了嵌入式真空包装系统的智能化设计。
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