Compact FinFET Memory Circuits with P-Type Data Access Transistors for Low Leakage and Robust Operation

S. Tawfik, V. Kursun
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引用次数: 19

Abstract

A new six transistor (6 T) SRAM cell with PMOS access transistors is proposed in this paper for reducing the leakage power consumption while enhancing the data stability and the integration density of FinFET memory circuits. With the proposed SRAM circuit, the voltage disturbance at the data storage nodes during a read operation is reduced by utilizing PMOS access transistors. The read stability is enhanced by 60% while reducing the leakage power by 21% as compared to a standard tied-gate FinFET SRAM cell with the same size transistors. One gate of each pull-up FinFET of the cross- coupled inverters is permanently disabled in order to achieve write-ability with minimum sized transistors. The proposed independent-gate FinFET SRAM circuit with P-type data access transistors reduces the idle mode leakage power, the read power, the write power, and the cell area by 61%, 20%, 11.4%, and 17.5%, respectively, as compared to a standard tied-gate FinFET SRAM cell sized for similar data stability in a 32 nm FinFET technology.
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具有p型数据访问晶体管的紧凑FinFET存储电路,具有低泄漏和鲁棒性
为了在降低泄漏功耗的同时提高FinFET存储电路的数据稳定性和集成密度,本文提出了一种新的六晶体管(6t) PMOS存取晶体管SRAM单元。在所提出的SRAM电路中,数据存储节点在读取操作期间的电压扰动通过使用PMOS访问晶体管来减小。与具有相同尺寸晶体管的标准束缚栅FinFET SRAM单元相比,读取稳定性提高了60%,同时泄漏功率降低了21%。交叉耦合逆变器的每个上拉FinFET的一个门被永久禁用,以便用最小尺寸的晶体管实现可写性。采用p型数据访问晶体管的独立栅极FinFET SRAM电路,与32 nm FinFET技术中具有类似数据稳定性的标准束缚栅极FinFET SRAM单元相比,其空闲模式泄漏功率、读取功率、写入功率和单元面积分别降低了61%、20%、11.4%和17.5%。
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