{"title":"Parametric Thermal Analyses Of Electronic Circuits With Green's Functions","authors":"M. Janicki, A. Napieralski","doi":"10.1109/MIXDES.2006.1706616","DOIUrl":null,"url":null,"abstract":"Thermal simulations are an indispensable stage in the design process of modern electronic circuits. This paper is intended to demonstrate how simple parametric thermal analyses of electronic circuits can be performed with reasonable accuracy using an analytical solution of the heat equation. The thermal model solution is found employing the Green's function approach without the use of any sophisticated and expensive numerical solver. The presented thermal simulations investigate the influence of various thermal model parameters on the temperature of a test structure. Similar analyses can be performed during the design of real electronic circuits as to optimise them thermally","PeriodicalId":318768,"journal":{"name":"Proceedings of the International Conference Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006.","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MIXDES.2006.1706616","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Thermal simulations are an indispensable stage in the design process of modern electronic circuits. This paper is intended to demonstrate how simple parametric thermal analyses of electronic circuits can be performed with reasonable accuracy using an analytical solution of the heat equation. The thermal model solution is found employing the Green's function approach without the use of any sophisticated and expensive numerical solver. The presented thermal simulations investigate the influence of various thermal model parameters on the temperature of a test structure. Similar analyses can be performed during the design of real electronic circuits as to optimise them thermally