Characterization of via holes on printed circuit boards

G. Antonini, M. Lai, A. Orlandi, V. Ricchiuti
{"title":"Characterization of via holes on printed circuit boards","authors":"G. Antonini, M. Lai, A. Orlandi, V. Ricchiuti","doi":"10.1109/SPI.2004.1409055","DOIUrl":null,"url":null,"abstract":"When high speed digital signals propagate on printed circuit boards (PCBs), all the on board discontinuities are a concern for the electronic designers. Among them, the via holes, allowing the signals to jump from an external PCB layer to an internal one, are of paramount importance. The paper compares the transmission performances of three different kind of single ended and differential vias (through, blind and buried), providing the better solution for propagating high speed digital signals on a multi-layer PCB.","PeriodicalId":119776,"journal":{"name":"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2004.1409055","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

When high speed digital signals propagate on printed circuit boards (PCBs), all the on board discontinuities are a concern for the electronic designers. Among them, the via holes, allowing the signals to jump from an external PCB layer to an internal one, are of paramount importance. The paper compares the transmission performances of three different kind of single ended and differential vias (through, blind and buried), providing the better solution for propagating high speed digital signals on a multi-layer PCB.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
印刷电路板上通孔的特性
当高速数字信号在印刷电路板(pcb)上传播时,所有的板上不连续是电子设计人员所关注的问题。其中,允许信号从外部PCB层跳到内部PCB层的通孔是至关重要的。本文比较了三种不同的单端和差分过孔(透孔、盲孔和埋孔)的传输性能,为在多层PCB上传输高速数字信号提供了较好的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters Sensitivity analysis of generic on-chip /spl Delta/I-noise simulation methodology A frequency domain approach for efficient model reduction of mixed VLSI circuits Non-uniform grid (NG) algorithm for fast capacitance extraction Dampening high frequency noise in high performance microprocessor packaging
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1