W. Schaff, K. Hur, L. Eastman, R. Compton, P. Mandeville
{"title":"Strained layer device epitaxy on patterned substrates [MODFETs]","authors":"W. Schaff, K. Hur, L. Eastman, R. Compton, P. Mandeville","doi":"10.1109/CORNEL.1993.303124","DOIUrl":null,"url":null,"abstract":"The growth of pseudomorphic MODFET structures on a patterned substrate was investigated as a means of increasing the critical layer thickness of strained layers. Prior to growth, semi-insulating GaAs substrates were patterned and etched using chemically assisted ion beam etching to define a series of mesas. Double-doped pseudomorphic MODFET layers were then grown on the substrates by molecular beam epitaxy. To fabricate MODFETs on the resulting non-planar wafer, a new fabrication technique has been developed.<<ETX>>","PeriodicalId":129440,"journal":{"name":"Proceedings of IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CORNEL.1993.303124","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The growth of pseudomorphic MODFET structures on a patterned substrate was investigated as a means of increasing the critical layer thickness of strained layers. Prior to growth, semi-insulating GaAs substrates were patterned and etched using chemically assisted ion beam etching to define a series of mesas. Double-doped pseudomorphic MODFET layers were then grown on the substrates by molecular beam epitaxy. To fabricate MODFETs on the resulting non-planar wafer, a new fabrication technique has been developed.<>