A. Hardock, S. Muller, X. Duan, H. Bruns, C. Schuster
{"title":"Minimizing displacement return currents in multilayer via structures","authors":"A. Hardock, S. Muller, X. Duan, H. Bruns, C. Schuster","doi":"10.1109/EPEPS.2012.6457878","DOIUrl":null,"url":null,"abstract":"A fast approach for the calculation of ground via return currents using the contour integral method is presented. From the analysis of the displacement currents design rules for optimized vias in multilayered boards are derived.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457878","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A fast approach for the calculation of ground via return currents using the contour integral method is presented. From the analysis of the displacement currents design rules for optimized vias in multilayered boards are derived.