Controlled collapse chip connection (C4)-an enabling technology

K. DeHaven, J. Dietz
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引用次数: 64

Abstract

Much of the technical information presented herein has been published by either IBM or Motorola This paper provides a higher-level view of the benefits, considerations and leverage applications of the C4 and DCA technologies. A key to acceptance and use of a new or different technology is its application in successful products. Although C4 is not new and has-been utilized extensively by IBM, it is different to Motorola. DCA is a relatively new technology and, thus, has a shorter history. As a foundation, this paper discusses the key C4 and DCA technical features and describes some initial product applications at Motorola. This linkage shows the enabling characteristics of the C4 flip-chip technology. Finally, future trends and directions of C4 and DCA technologies are discussed.<>
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可控折叠芯片连接(C4)-使能技术
本文提供的大部分技术信息都是由IBM或Motorola发布的。本文从更高级的角度介绍了C4和DCA技术的优点、注意事项和利用应用。接受和使用一种新的或不同的技术的关键是它在成功产品中的应用。尽管C4并不新鲜,而且已经被IBM广泛使用,但它与摩托罗拉不同。DCA是一项相对较新的技术,因此历史较短。在此基础上,本文讨论了C4和DCA的关键技术特征,并描述了摩托罗拉公司的一些初步产品应用。这一链接显示了C4倒装芯片技术的使能特性。最后,对C4和DCA技术的未来发展趋势和方向进行了讨论。
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