Field effect passivation of plasma oxidized SiOx layer on boron emitter surface by PECVD

Sehyeon Kim, Kumar Mallem, Sooyoung Park, Sanchari Chowdary, Seyoun Kim, Jinsu Park, Jamein Kim, M. Ju, Youngkuk Kim, E. Cho, Y. Cho, J. Yi
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Abstract

An ultra thin surface passivation layer is essential to reduce the surface recombination and enhance the open circuit voltage for high efficiency crystalline silicon (c-Si) solar cells. In that, we developed charge injection controllable thin films of SiOX and SiNX layers by PECVD for surface passivation of boron emitter c-Si surface. The refractive index of the SiOX/SiNX stack was optimized by varying the SiH4, NH3 and N2O gas ratios. Lower Dit of 5 × 1010 cm2 eV1 and high Qeff of −1.71 × 1011 cm2 was obtained for 10 nm thick SiOX layer. The fabricated n-Si bifacial cell with insertion of 10 nm thick SiOX layer archived efficiency (η) of 19.48 % with fill factor (FF) of 77.5 %, whereas the cell without SiOX layer showed an η of 18.20 % with FF of 75.77.
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硼发射极表面等离子体氧化SiOx层的场效应钝化
超薄的表面钝化层对于减少晶体硅(c-Si)太阳能电池的表面复合和提高开路电压至关重要。其中,我们用PECVD法制备了SiOX和SiNX层电荷注入可控薄膜,用于硼发射极c-Si表面钝化。通过改变SiH4、NH3和N2O气体的比例,优化了SiOX/SiNX叠层的折射率。对于10 nm厚的SiOX层,获得了较低的Dit为5 × 1010 cm−2 eV−1和较高的Qeff为−1.71 × 1011 cm−2。插入10 nm厚SiOX层制备的n-Si双面电池的效率(η)为19.48%,填充因子(FF)为77.5%,而未插入SiOX层的电池的η为18.20%,填充因子(FF)为75.77。
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