A framework for reliability modeling of electronics

Abstract

The physics-of-failure approach (PoF) to design, reliability modeling, testing and screening of single chip IC packages and multichip modules (MCM), has been developed. The PoF approach is implemented using CADMP-II software. The PoF approach is based on the identification of potential failure mechanisms and failure sites for the product. Failure mechanisms are described by models which characterize the physics of degradation processes leading to failure at each potential failure site. The loads at each failure site are obtained as a function of environmental and operation conditions. The approach preactively incorporates reliability in the design process by establishing a scientific basis for evaluation of new materials, structures, and technologies, through design of tests, screens, safety factors, and acceleration transforms, based on the knowledge of failure mechanisms and modes.