The Impact of Defect formed in Hot-cutting Process on Reliability of Ceramic Packaging And A Novel Structure Design Concept

C. Zeng, Chunqing Wang, Yanhong Tian, Lingchao Kong
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Abstract

This paper investigates the defect formed by the mechanical cutting processing of green sheet of alumina ceramic by evaluating the surface integrity in terms of surface morphology, and the flexural strength and its variance. The Weibull strength distribution method is introduced to compare the strength between defect-contained specimens and specimens without hot-cutting defect. Experimental results show that the defect causes a remarkable decline in strength and small specimens are more affected than big ones. The surface contains the hot-cutting defect is more dangerous than the natural surface. A FEM method (ANSYS) is utilized to quantitatively evaluate residual stresses of the ceramic insulator in brazing process. Based on the stress analysis, a Defect-free-stress design concept is put forward to give some guidance to structure design and material selection.
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热切割过程中形成的缺陷对陶瓷封装可靠性的影响及一种新的结构设计理念
本文从表面形貌、抗弯强度及其方差等方面评价了氧化铝陶瓷生坯的表面完整性,对机械切削加工过程中形成的缺陷进行了研究。采用Weibull强度分布法对含缺陷试样与不含热切割缺陷试样进行强度比较。试验结果表明,缺陷对试件强度的影响显著,且小试件受影响程度大于大试件。含有热切割缺陷的表面比天然表面更危险。采用有限元分析方法(ANSYS)对陶瓷绝缘子钎焊过程中的残余应力进行了定量评价。在应力分析的基础上,提出了无缺陷应力设计理念,对结构设计和材料选择具有一定的指导意义。
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