Micro-assembly for top-down nanotechnology

Abstract

A top-down assembly approach to nanotechnology starting with parts using MEMS techniques is presented. MEMS components, built with integrated circuit manufacturing processes, can be used to fabricate complex parts with integrated functionality. These parts can be used in assemblies at the micron length scale and above. To pursue assemblies of this type certain developments are necessary to constrain parts until needed, mechanically and electrically couple parts, and handle parts. A system architecture, scalable to smaller sizes, for assembling such parts in exponential and massively parallel manners is presented. Some progress towards these developments has been made by demonstrations of reversible positional component tethering and reversible positional mechanical coupling.