Kang-Sun Choi, Jae-Young Pyun, Nam-Hyeong Kim, Byeong-Doo Choi, S. Ko
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引用次数: 29
Abstract
The PCB inspection system presented in this paper can detect defects including the breaks in the wires and short circuit and is significantly faster when compared to the existing techniques. The proposed inspection method is based on referential matching between the stored reference image and the test (observed) image. Block matching is performed to solve the misalignment in referential matching. In order to reduce the computational complexity, we implement the proposed algorithm using the single instruction multiple data (SIMD) instructions, so called SSE2.
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