A Cost-saving Thermal Test Chip Design in a Test Vehicle of Large BGA

Abstract

Special chip design for thermal test has been developed for a long time for assessment of package thermal characteristics, evaluation of material thermal performance, and validation of thermal models and simulations. Nevertheless, most of the thermal test chip design is independent from the real chip development, leading to thermal test chip hardly be used in the new products with advanced manufacture node and new packaging type. In this paper, we proposed a cost-saving thermal test chip which can be synchronously developed and combined with daisy chain design for package reliability test. This thermal test chip contains metal strip resistors for heating and resistive temperature sensor for temperature monitor. It helps to study the package thermal characteristics and evaluate the performance and reliability of thermal interface material applied in flip-chip ball grid array package.