Techniques to Compensate Ion Depletion in the Coupling Region of Directional Couplers Manufactured by Field-Assisted Diffusion

Abstract

The field-assisted diffusion process is the commonly utilized manufacturing technology for fabricating integrated directional couplers that are used for bidirectional chip-to-chip communication in Electro-Optical Printed Circuit Boards (EOPCBs) [1]. Since an ion depletion occurs in regions where two waveguides approach each other due to superimposed fields, two techniques to compensate this ion depletion are introduced. Both methods are then investigated as an optimization approach for the design of an integrated directional coupler.