{"title":"Session details: Design Methodology for 3D IC","authors":"Liangzhen Lai, M. Ziegler","doi":"10.1145/3256014","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":142716,"journal":{"name":"Proceedings of the 2016 International Symposium on Low Power Electronics and Design","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2016 International Symposium on Low Power Electronics and Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3256014","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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