Improved Electron-Beam / DUV Intra-Level Mix-and-Match As A Production Viable Lithography With 100-nm Resolution

S. Magoshi, H. Niiyama, S. Sato, Y. Kato, Y. Watanabe, T. Shibata, M. Ito, A. Ando, T. Nakasugi, K. Sugihara, K. Okumura
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引用次数: 1

Abstract

1. Jnwoduction The electron(e)-beam / deep ultraviolet (DUV) “intra-level” mix-and-match (ILM&M) strategy proposed by several groups [ 1,2,3] is an attractive concept to increase the throughput of the ebeam direct write (EBDW), while keeping its superior resolution. Nevertheless, in order that the LM&M may play important role in production of leading edge devices in the near future, the throughput and the overlay accuracy must be improved drastically. We propose an improved ILM&M as a production viable lithography featuring a D W biased exposure and a scanning DUV stepper without h igh rde r components of the image field distortion. The proposed ILM&M has been successfully applied to development and early production of leading edge devices in our laboratory.
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改进的电子束/ DUV级内混配作为生产可行的100纳米分辨率光刻技术
1. 几个小组[1,2,3]提出的电子(e)束/深紫外(DUV)“层内”混配(ILM&M)策略是一个有吸引力的概念,可以提高电子束直接写入(EBDW)的吞吐量,同时保持其优越的分辨率。然而,为了使LM&M在不久的将来在前沿器件的生产中发挥重要作用,必须大幅提高吞吐量和覆盖精度。我们提出了一种改进的ILM&M作为生产可行的光刻技术,该光刻具有dw偏置曝光和扫描DUV步进,没有高阶分量的图像场畸变。所提出的ILM&M已成功应用于我们实验室前沿器件的开发和早期生产。
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