Study of thermal interfaces aging for power electronics applications

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2011-03-20 DOI:10.1109/STHERM.2011.5767171

J. Ousten, Zoubir Khatir, Ludovic Menager

引用次数: 7

Abstract

This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone more than 850 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% decrease of initial thermal resistance.

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电力电子应用热界面老化研究

本文对热界面材料(TIM)在热循环条件下的老化进行了新的研究。挑战在于设计一个特定的原始设置，不仅要承受航空电子温度任务剖面(-50°C/150°C)，还要在始终相同的条件下执行标准化的热表征。使用导热系数作为老化指标。几种TIM材料(相变、石墨和聚合物基)已经经历了850多次这样的循环。结果表明，只有相变材料热界面受到影响，初始热阻降低了30%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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