Feasibility study of integrated vertical and lateral IMOS and TFET devices for nano-scale transistors

P. Divya, I. Saad
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引用次数: 6

Abstract

A review on the integration of vertical impact ionization MOSFET (IMOS) with vertical tunnelling FET (TFET) has been presented in this paper. A comparison has been done on the lateral and vertical I-MOS and TFET device structures, highlighting the advantages and drawbacks of each device. Integration of I-MOS and TFET on a vertical scale is seen as one of the promising solutions, to continue the trend of scaling down the devices further, in the nanometer regime.
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纳米级晶体管纵向和横向集成IMOS和TFET器件的可行性研究
本文综述了垂直冲击电离场效应管(IMOS)与垂直隧穿场效应管(TFET)的集成研究进展。比较了横向和纵向的I-MOS和TFET器件结构,突出了每种器件的优点和缺点。I-MOS和TFET的垂直集成被视为一种有前途的解决方案,以继续在纳米范围内进一步缩小器件的趋势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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