Chengjie Xi, Aslam A. Khan, M. Tanjidur Rahman, N. Asadizanjani
{"title":"Security Assessment of IC Packaging Against Optical Attacks","authors":"Chengjie Xi, Aslam A. Khan, M. Tanjidur Rahman, N. Asadizanjani","doi":"10.31399/asm.edfa.2021-2.p004","DOIUrl":null,"url":null,"abstract":"\n The inverted orientation of a flip-chip packaged die makes it vulnerable to optical attacks from the backside. This article discusses the nature of that vulnerability, assesses the threats posed by optical inspection tools and techniques, and provides insights on effective countermeasures.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2021-2.p004","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The inverted orientation of a flip-chip packaged die makes it vulnerable to optical attacks from the backside. This article discusses the nature of that vulnerability, assesses the threats posed by optical inspection tools and techniques, and provides insights on effective countermeasures.
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