4H-silicon carbide mesfet with 2.8 W/mm rf power density

J. Palmour, C. Weitzel, K. Nordquist, C. Carter
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引用次数: 2

Abstract

Silicon carbide has tremendous potential for high power microwave devices because of its high breakdown electric field (4x106 V/cm), high thermal conductivity (4.9 W/cm-K), high saturated electron drift velocity ( 2 . 0 ~ 107 cm/sec) and low dielectric constant (10.0). The high velocity allows the devices to operate at relatively high frequencies despite the low mobility of S i c . The high breakdown field allows about ten times higher voltages to be applied for a given channel doping, which should allow a much higher output power density to be achieved than with Si or GaAsl . Submicron MESFETs have been previously fabricated in 6H-Sic and have shown desirable microwave performance with RF output powers of about 1 W/mm at 1-2 G H Z ~ ~ ~ . However, another polytype, 4H-SiC, shows even more potential for high power, high frequency operation, because its electron mobility (>550 cm2/V-sec) is about twice that of 6H-Sic. Thus we report the first DC, S-parameter, and output power results obtained with 4H-Sic MESFETs.
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具有2.8 W/mm射频功率密度的4h碳化硅介面
碳化硅具有高击穿电场(4x106 V/cm)、高导热系数(4.9 W/cm- k)、高饱和电子漂移速度(2。0 ~ 107 cm/sec)和低介电常数(10.0)。高速度允许器件在相对高的频率下工作,尽管低迁移率的超导。高击穿场允许对给定通道掺杂施加大约十倍高的电压,这应该允许比Si或GaAsl实现更高的输出功率密度。亚微米mesfet先前已在6H-Sic中制造,并显示出理想的微波性能,在1-2 G H Z下RF输出功率约为1 W/mm。然而,另一种多型,4H-SiC,显示出更大的潜力,高功率,高频工作,因为它的电子迁移率(bbb5050cm2 /V-sec)大约是6H-Sic的两倍。因此,我们报告了用4H-Sic mesfet获得的第一个直流、s参数和输出功率结果。
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