Algorithmic Diagnosis of Multichip Module Defects Using the IEEE 1149.1 Standard

Abstract

The importance of a thorough test and accurate diagnosis of multichip module defects cannot be overemphasized. The cost of repairing a module coupled with the cost of the die which constitute the typical MCM makes an error in the defect analysis very expensive. Given the lack of access to the internal nodes of an MCM and given that the most common faults are expected to be manufacturing defects (opens shorts, wrong die, physical damage to the die, etc.), the IEEE 1149.1 boundary-scan standard is expected to play a very important role in the accurate diagnosis of a large percentage of module problems.