{"title":"An integrated analytic approach for reliability improvement (of weapons systems)","authors":"H.C. Fortna, R. Zavada, T. Warren","doi":"10.1109/ARMS.1990.67955","DOIUrl":null,"url":null,"abstract":"Repair data from MK12 Phalanx close-in weapon system (CIWS) depots were analyzed by component removal locations on the 13 highest-failure circuit card assemblies (CCAs). This analysis showed several clusters on the mode-system-control CCA that were believed to be caused by high temperature. With a finite-difference technique, a thermal model of these clustered areas was devised, and it verified that the resistors were operating in their upper temperature range. To assure that the analysis was reasonable, a training CIWS was wired with the thermocouples and operated. The testing verified that the analysis was reasonable and could be used to determine the effect of circuit changes on the temperature profile of this CCA. Recommendations were made to reduce the heat generated in the cluster or to increase the airflow in the region of the CCA. An estimate of potential cost savings provided the final information needed by management to decide how to proceed.<<ETX>>","PeriodicalId":383597,"journal":{"name":"Annual Proceedings on Reliability and Maintainability Symposium","volume":"65 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Annual Proceedings on Reliability and Maintainability Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARMS.1990.67955","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Repair data from MK12 Phalanx close-in weapon system (CIWS) depots were analyzed by component removal locations on the 13 highest-failure circuit card assemblies (CCAs). This analysis showed several clusters on the mode-system-control CCA that were believed to be caused by high temperature. With a finite-difference technique, a thermal model of these clustered areas was devised, and it verified that the resistors were operating in their upper temperature range. To assure that the analysis was reasonable, a training CIWS was wired with the thermocouples and operated. The testing verified that the analysis was reasonable and could be used to determine the effect of circuit changes on the temperature profile of this CCA. Recommendations were made to reduce the heat generated in the cluster or to increase the airflow in the region of the CCA. An estimate of potential cost savings provided the final information needed by management to decide how to proceed.<>
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